![]() You require advanced design and production skills for using SMT when compared to through-hole technology.Through-hole components involve higher manufacturing costs than SMT components.SMT frees up the limitation on board space posed by the through-hole mounting manufacturing process.SMT and through-hole capacitor Major differences between through-hole technology and surface mount technology Also, through-hole technology limits the routing area for signal traces below the top layer of multi-layer PCBs. However, drilling PCBs during production tends to increase manufacturing costs. Since through-hole mounting offers strong mechanical bonds, it is highly reliable. These leads are then soldered to pads on the opposite side using wave soldering or re-flow soldering tools. In through-hole technology, the component leads are inserted into the drilled holes on the board. Apply solder paste to the fabricated circuit board using stencils. Solder paste is made up of flux and tin particles.These components have smaller leads or no leads at all and are smaller than through-hole components. They are suitable for applications with higher routing densities. ![]() Most electronic applications prefer to use surface mount components since they are compact and may be installed on either side of a printed circuit. SMT allows electrical components to be mounted on the board surface without any drilling. Salient features of SMT and through-hole technology Surface mounting enables a higher degree of automation minimizing labor costs and expanding production rates that results in the development advanced of boards. SMT led to much smaller components and enabled component placement on both sides of the board. This replaced typical wire leads which needed to pass through drilled holes. Conventional electronic components were redesigned to include metal tabs or end caps that could be attached directly to the board surface. By the 1990s, they were used in most of the high-end PCB assemblies. Surface-mount technology was developed in the 1960s and was broadly used in the 1980s. There are various advantages and disadvantages of surface mount technology which we will discuss over the course of this article. ![]() The introduction of surface mount technology has enabled manufacturers to fabricate smaller size complex circuit boards. SMT was developed to minimize manufacturing costs while making efficient use of board space. Electronic components mounted this way are called surface-mounted devices (SMD). Surface mount technology is a part of the electronic assembly that deals with the mounting of electronic components to the surface of a PCB.
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